If you’re in the market for a new IC, it’s important to know the difference between the DIP package vs SOP package. Although both are designed with similar functionality, they have slightly different physical characteristics and may be better for certain applications. In this article, we’ll look at the differences between the two packages and explain how they compare.
Small-outline IC (SOIC) packages
Small-outline IC packages are the surface-mount cousins of DIPs and are among the easiest SMD parts to solder by hand. They are also known as shrink-SOP and TSSOP. They have the same pinout as DIPs, but are generally smaller.
Plastic Dual In-Line Package (PDIP)
The DIP package is a type of semiconductor package in which two plastic halves are bonded around the lead pads. This package has poor hermeticity and is often susceptible to moisture. It is also bulkier than modern dual-in-line packages.
Pin count
If you are trying to decide between a DIP package and a SOP package, it is important to know how many pins each has. The DIP package typically has eight pins and the SOP has up to 44. The pinout of each type varies, but both types have similar circuit configurations. In most cases, choosing one over the other will result in lower board space requirements and fabrication costs, while guaranteeing less power consumption.
Heat dissipation
There are a number of differences between DIP and SOP packages. The DIP package has a lower profile, whereas the SOJ package has a high profile. The SOJ package has a lead that emerges on both sides, and then bends downward 90 degrees. The leads are also angled upward to be parallel to the bottom plane of the package.
Application
DIP and SOP packages are very similar in circuit configuration. However, there are differences in size, pin mapping, and spacing. This means that you should consider the pin count of your target application when choosing a DIP or SOP package. The JEITA/EIAJ package is more common among ICs with higher pin counts. For example, Texas Instruments refers to their parts in JEDEC 3.9 mm width as SOIC while Fairchild Semiconductor refers to their parts as SOP.